US$ 499.50
this mainboard is the right choice
Suitable for a variety of MSLA-/LCD 3D printers
For optimal results
Through seamless integration with Unreal Engine
Printer: K2 Pro CoreXY system
Slice Engineering Mako Hotend für Bambu Lab X1/X1C – mit Bondtech CHT Fin Düse Hersteller_ELEGOO this mainboard is the rightSlice Engineering Mako Hotend with Bondtech CHT Fin Nozzle is a powerful upgrade for Bambu Lab X1 and X1 Carbon (X1C). With an all metal construction, precise temperature control, and optimized nozzle technology, it delivers detailed print results even at high speeds. Highlights: Direct replacement for Bambu Lab X1 & X1 Carbon Hotend Includes Bondtech CHT Fin Nozzle (0. 4 mm) for sharp details Supports up to 300 C compatible with technical filaments
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